Interpretation of standard system and cutting-edge methods for testing mechanical properties of semiconductor materials

1. Why should we pay attention to the mechanical properties of semiconductor materials?

Chip integration continues to increase, and the interconnection structure has entered the nanoscale. The bonding strength of the material interface in advanced packaging, the mechanical properties of the film, and the mechanical impact resistance of the packaging structure directly affect chip yield and service reliability.Traditional macroscopic mechanical testing cannot cover these microstructures, making mechanical characterization of semiconductor materials a key technical link in the industry.

2. Current status of relevant standard systems

1. Tensile test of film materials

GB/T 42709.2-2026"Semiconductor Devices Microelectronic Mechanical Devices Part 2: Tensile Test Methods for Thin Film Materials", adopted in accordance with IEC 62047-2, provides a unified method for tensile property testing of thin film materials and is an important basis for material characterization of microelectronic mechanical devices (MEMS).In addition, the national standard plan for "Microelectronic Mechanical Devices Part 8: Bending Test Method for Measurement of Tensile Properties of Strip Films" is being formulated.

2. Mechanical and climatic test method series

GB/T 4937 series"Semiconductor Devices - Mechanical and Climatic Test Methods" is continuously updated. The volumes on mechanical shock, steady-state acceleration, and board-level drop will be released at the end of 2025 and will be implemented on July 1, 2026, providing a systematic method for the mechanical reliability verification of semiconductor devices.

3. Flexible and stretchable semiconductor devices

GB/T47239.8-2026"Semiconductor Devices - Flexible and Stretchable Semiconductor Devices Part 8" stipulates the ductility, flexibility and stability testing of flexible resistive memories and other devices to respond to the industrialization needs of flexible electronics.

4. Mechanical properties of substrate materials

The standard plan under preparation, "Test Methods for Flat Panel Display Substrate Glass Part 4: Mechanical Properties," is under the jurisdiction of the National Technical Committee for Standardization of Semiconductor Equipment and Materials and covers the testing of mechanical properties of key materials such as substrate glass.

3. Trends in cutting-edge testing methods

1. In situ characterization: In-situ nanoindentation, in-situ stretching, and microscopy/electron microscopy are combined to observe the microscopic deformation and crack evolution of the material in real time during the loading process, and obtain key parameters such as interface bonding strength and fracture toughness;

2. Micro/nanoscale mechanics: Indicators such as the critical energy release rate of interface delamination for advanced packaging have become the quantitative basis for material access;

3. environmentcouplingtest: Conduct mechanical tests under environmental conditions such as temperature and humidity to simulate the actual service conditions of the device;

4. dynamic reliability: Dynamic load tests such as board-level drop and steady-state acceleration are complementary to static tests.

4. Requirements for testing equipment and laboratories

• Requires high-resolution force/displacement measurement and micron-nano-level positioning accuracy;

• Need to support in-situ observation, environmental chamber and other extended configurations;

• The fixture design needs to be adapted to small-sized, thin, and flexible specimens;

• Testing data needs to be traceable and reproducible to meet material access and yield management requirements.

5. Layout of Shandong Huayan Intelligent

Shandong Huayan Intelligent Equipment Group Co., Ltd. continues to track the mechanical testing standards of semiconductor materials and microelectronic devices, and can provide solution consulting, equipment selection and customized development support for precision mechanical testing of films, devices, and flexible materials, helping customers build testing capabilities for advanced manufacturing.